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EPC2039

EPC2039

EPC2039

EPC

TRANS GAN 80V BUMPED DIE

SOT-23

EPC2039 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case Die
Supplier Device Package Die
Operating Temperature-40°C~150°C TJ
PackagingTape & Reel (TR)
Series eGaN®
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Technology GaNFET (Gallium Nitride)
FET Type N-Channel
Rds On (Max) @ Id, Vgs 25mOhm @ 6A, 5V
Vgs(th) (Max) @ Id 2.5V @ 2mA
Input Capacitance (Ciss) (Max) @ Vds 210pF @ 40V
Current - Continuous Drain (Id) @ 25°C 6.8A Ta
Gate Charge (Qg) (Max) @ Vgs 2.4nC @ 5V
Drain to Source Voltage (Vdss) 80V
Drive Voltage (Max Rds On,Min Rds On) 5V
Vgs (Max) +6V, -4V
RoHS StatusROHS3 Compliant
In-Stock:4686 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.665257$1.665257
10$1.570997$15.70997
100$1.482073$148.2073
500$1.398182$699.091
1000$1.319040$1319.04

About EPC2039

The EPC2039 from EPC is a high-performance microcontroller designed for a wide range of embedded applications. This component features TRANS GAN 80V BUMPED DIE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EPC2039, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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