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EPC2022

EPC2022

EPC2022

EPC

GAN TRANS 100V 3MOHM BUMPED DIE

SOT-23

EPC2022 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case Die
Supplier Device Package Die
Operating Temperature-40°C~150°C TJ
PackagingTape & Reel (TR)
Published 2016
Series eGaN®
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Technology GaNFET (Gallium Nitride)
FET Type N-Channel
Rds On (Max) @ Id, Vgs 3.2mOhm @ 25A, 5V
Vgs(th) (Max) @ Id 2.5V @ 12mA
Input Capacitance (Ciss) (Max) @ Vds 1500pF @ 50V
Current - Continuous Drain (Id) @ 25°C 60A Ta
Drain to Source Voltage (Vdss) 100V
Drive Voltage (Max Rds On,Min Rds On) 5V
Vgs (Max) +6V, -4V
Continuous Drain Current (ID) 60A
Input Capacitance1.5nF
Rds On Max 3.2 mΩ
RoHS StatusROHS3 Compliant
In-Stock:1020 items

Pricing & Ordering

QuantityUnit PriceExt. Price
500$4.77400$2387

About EPC2022

The EPC2022 from EPC is a high-performance microcontroller designed for a wide range of embedded applications. This component features GAN TRANS 100V 3MOHM BUMPED DIE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EPC2022, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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