Name: EPC2021ENGR
Brand: EPC
SKU: EPC2021ENGR
Availability: InStock

new-10%

EPC2021ENGR

Manufacturer part number:EPC2021ENGR

Manufacturer:EPC

Description:TRANS GAN 80V 60A BUMPED DIE

Case Package:SOT-23

Datasheet:EPC2021ENGR Datasheet PDF

RoHs Status:non-compliant

Parameter Name	Value
Type	Parameter
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	Die
Supplier Device Package	Die
Operating Temperature	-40°C~150°C TJ
Packaging	Cut Tape (CT)
Published	2012
Series	eGaN®
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Max Operating Temperature	150°C
Min Operating Temperature	-40°C
Technology	GaNFET (Gallium Nitride)
FET Type	N-Channel
Rds On (Max) @ Id, Vgs	2.5mOhm @ 29A, 5V
Vgs(th) (Max) @ Id	2.5V @ 14mA
Input Capacitance (Ciss) (Max) @ Vds	1700pF @ 40V
Current - Continuous Drain (Id) @ 25°C	60A Ta
Gate Charge (Qg) (Max) @ Vgs	15nC @ 5V
Drain to Source Voltage (Vdss)	80V
Drive Voltage (Max Rds On,Min Rds On)	5V
Vgs (Max)	+6V, -4V
Continuous Drain Current (ID)	60A
Input Capacitance	1.7nF
Rds On Max	2.5 mΩ
RoHS Status	RoHS Compliant

About EPC2021ENGR

The EPC2021ENGR from EPC is a high-performance microcontroller designed for a wide range of embedded applications. This component features TRANS GAN 80V 60A BUMPED DIE.

Key Features

Advanced AVR architecture for efficient processing
Wide operating temperature range: -40°C to 85°C
Low power consumption for energy-efficient applications
Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

Industrial control systems
Consumer electronics
Automotive systems
IoT devices
Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EPC2021ENGR, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.