EPC2016

Manufacturer part number:EPC2016

Manufacturer:EPC

Description:TRANS GAN 100V 11A BUMPED DIE

Case Package:SOT-23

Datasheet:EPC2016 Datasheet PDF

RoHs Status:non-compliant

Parameter Name	Value
Type	Parameter
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	Die
Supplier Device Package	Die
Operating Temperature	-40°C~125°C TJ
Packaging	Tape & Reel (TR)
Published	2012
Series	eGaN®
Part Status	Discontinued
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Max Operating Temperature	125°C
Min Operating Temperature	-40°C
Technology	GaNFET (Gallium Nitride)
FET Type	N-Channel
Rds On (Max) @ Id, Vgs	16mOhm @ 11A, 5V
Vgs(th) (Max) @ Id	2.5V @ 3mA
Input Capacitance (Ciss) (Max) @ Vds	520pF @ 50V
Current - Continuous Drain (Id) @ 25°C	11A Ta
Gate Charge (Qg) (Max) @ Vgs	5.2nC @ 5V
Drain to Source Voltage (Vdss)	100V
Drive Voltage (Max Rds On,Min Rds On)	5V
Vgs (Max)	+6V, -5V
Continuous Drain Current (ID)	11A
Input Capacitance	520pF
Rds On Max	16 mΩ
RoHS Status	ROHS3 Compliant

About EPC2016

The EPC2016 from EPC is a high-performance microcontroller designed for a wide range of embedded applications. This component features TRANS GAN 100V 11A BUMPED DIE.

Key Features

Advanced AVR architecture for efficient processing
Wide operating temperature range: -40°C to 85°C
Low power consumption for energy-efficient applications
Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

Industrial control systems
Consumer electronics
Automotive systems
IoT devices
Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EPC2016, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.