EPC2015

Manufacturer part number:EPC2015

Manufacturer:EPC

Description:TRANS GAN 40V 33A BUMPED DIE

Case Package:SOT-23

Datasheet:EPC2015 Datasheet PDF

RoHs Status:non-compliant

Parameter Name	Value
Type	Parameter
Factory Lead Time	14 Weeks
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	Die
Supplier Device Package	Die Outline (11-Solder Bar)
Operating Temperature	-40°C~150°C TJ
Packaging	Cut Tape (CT)
Published	2011
Series	eGaN®
Part Status	Discontinued
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Technology	GaNFET (Gallium Nitride)
FET Type	N-Channel
Rds On (Max) @ Id, Vgs	4mOhm @ 33A, 5V
Vgs(th) (Max) @ Id	2.5V @ 9mA
Input Capacitance (Ciss) (Max) @ Vds	1200pF @ 20V
Current - Continuous Drain (Id) @ 25°C	33A Ta
Gate Charge (Qg) (Max) @ Vgs	11.6nC @ 5V
Drain to Source Voltage (Vdss)	40V
Drive Voltage (Max Rds On,Min Rds On)	5V
Vgs (Max)	+6V, -5V
Continuous Drain Current (ID)	33A
Input Capacitance	1.2nF
Rds On Max	4 mΩ
RoHS Status	ROHS3 Compliant

About EPC2015

The EPC2015 from EPC is a high-performance microcontroller designed for a wide range of embedded applications. This component features TRANS GAN 40V 33A BUMPED DIE.

Key Features

Advanced AVR architecture for efficient processing
Wide operating temperature range: -40°C to 85°C
Low power consumption for energy-efficient applications
Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

Industrial control systems
Consumer electronics
Automotive systems
IoT devices
Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EPC2015, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.