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EPC2012C

EPC2012C

EPC2012C

EPC

GANFET TRANS 200V 5A BUMPED DIE

SOT-23

EPC2012C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case Die
Supplier Device Package Die Outline (4-Solder Bar)
Operating Temperature-40°C~150°C TJ
PackagingTape & Reel (TR)
Published 2012
Series eGaN®
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Operating Temperature150°C
Min Operating Temperature -40°C
Technology GaNFET (Gallium Nitride)
FET Type N-Channel
Rds On (Max) @ Id, Vgs 100mOhm @ 3A, 5V
Vgs(th) (Max) @ Id 2.5V @ 1mA
Input Capacitance (Ciss) (Max) @ Vds 140pF @ 100V
Current - Continuous Drain (Id) @ 25°C 5A Ta
Gate Charge (Qg) (Max) @ Vgs 1.3nC @ 5V
Drain to Source Voltage (Vdss) 200V
Drive Voltage (Max Rds On,Min Rds On) 5V
Vgs (Max) +6V, -4V
Continuous Drain Current (ID) 5A
Input Capacitance140pF
Rds On Max 100 mΩ
RoHS StatusROHS3 Compliant
In-Stock:2917 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$6.374377$6.374377
10$6.013563$60.13563
100$5.673173$567.3173
500$5.352050$2676.025
1000$5.049104$5049.104

About EPC2012C

The EPC2012C from EPC is a high-performance microcontroller designed for a wide range of embedded applications. This component features GANFET TRANS 200V 5A BUMPED DIE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EPC2012C, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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