EPC2007

Manufacturer part number:EPC2007

Manufacturer:EPC

Description:TRANS GAN 100V 6A BUMPED DIE

Case Package:SOT-23

Datasheet:EPC2007 Datasheet PDF

RoHs Status:non-compliant

Parameter Name	Value
Type	Parameter
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	Die
Supplier Device Package	Die Outline (5-Solder Bar)
Operating Temperature	-40°C~125°C TJ
Packaging	Cut Tape (CT)
Published	2013
Series	eGaN®
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Technology	GaNFET (Gallium Nitride)
FET Type	N-Channel
Rds On (Max) @ Id, Vgs	30mOhm @ 6A, 5V
Vgs(th) (Max) @ Id	2.5V @ 1.2mA
Input Capacitance (Ciss) (Max) @ Vds	205pF @ 50V
Current - Continuous Drain (Id) @ 25°C	6A Ta
Gate Charge (Qg) (Max) @ Vgs	2.8nC @ 5V
Drain to Source Voltage (Vdss)	100V
Drive Voltage (Max Rds On,Min Rds On)	5V
Vgs (Max)	+6V, -5V
Continuous Drain Current (ID)	6A
Input Capacitance	205pF
Rds On Max	30 mΩ
RoHS Status	RoHS Compliant

About EPC2007

The EPC2007 from EPC is a high-performance microcontroller designed for a wide range of embedded applications. This component features TRANS GAN 100V 6A BUMPED DIE.

Key Features

Advanced AVR architecture for efficient processing
Wide operating temperature range: -40°C to 85°C
Low power consumption for energy-efficient applications
Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

Industrial control systems
Consumer electronics
Automotive systems
IoT devices
Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EPC2007, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.