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B57-050-261-202

B57-050-261-202

B57-050-261-202

EDAC Inc.

B57-050-261-202 datasheet pdf and D-Shaped Connectors - Centronics product details from EDAC Inc. stock available on our website

SOT-23

B57-050-261-202 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Mount Through Hole
Mounting Type Through Hole, Right Angle
Housing Material Thermoplastic
Series B57, MDR
Published 2005
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Receptacle
Number of Positions 50
Max Operating Temperature105°C
Min Operating Temperature -55°C
Number of Rows 2
Gender Female
Orientation Right Angle
Current Rating5A
Contact Finish Gold
Housing Color Blue
Flange Feature Housing/Shell (4-40)
Max Voltage Rating (AC) 250V
Max Current Rating 5A
Connector Style Outer Shroud Contacts
Length 82.8mm
Width 15.2mm
Contact Finish Thickness Flash
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:796 items

Pricing & Ordering

QuantityUnit PriceExt. Price
25$9.34000$233.5

About B57-050-261-202

The B57-050-261-202 from EDAC Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features B57-050-261-202 datasheet pdf and D-Shaped Connectors - Centronics product details from EDAC Inc. stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B57-050-261-202, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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