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DMN61D8LVTQ-7

DMN61D8LVTQ-7

DMN61D8LVTQ-7

Diodes Incorporated

MOSFET 2N-CH 60V 0.63A TSOT26

SOT-23

DMN61D8LVTQ-7 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 17 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case SOT-23-6 Thin, TSOT-23-6
Operating Temperature-55°C~150°C TJ
PackagingTape & Reel (TR)
Published 2015
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Max Power Dissipation820mW
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Power - Max 820mW
FET Type 2 N-Channel (Dual)
Rds On (Max) @ Id, Vgs 1.8 Ω @ 150mA, 5V
Vgs(th) (Max) @ Id 2V @ 1mA
Input Capacitance (Ciss) (Max) @ Vds 12.9pF @ 12V
Gate Charge (Qg) (Max) @ Vgs 0.74nC @ 5V
Drain to Source Voltage (Vdss) 60V
Continuous Drain Current (ID) 630mA
FET Feature Logic Level Gate
RoHS StatusROHS3 Compliant
In-Stock:15321 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.170058$1.170058
10$1.103828$11.03828
100$1.041348$104.1348
500$0.982403$491.2015
1000$0.926796$926.796

About DMN61D8LVTQ-7

The DMN61D8LVTQ-7 from Diodes Incorporated is a high-performance microcontroller designed for a wide range of embedded applications. This component features MOSFET 2N-CH 60V 0.63A TSOT26.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the DMN61D8LVTQ-7, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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