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XPGBUTWTL1R25000FE7

XPGBUTWTL1R25000FE7

XPGBUTWTL1R25000FE7

CREEINC

XPGBUTWTL1R25000FE7 datasheet pdf and Backplanes product details from CREEINC stock available on our website

SOT-23

XPGBUTWTL1R25000FE7 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time NRND (Last Updated: 1 week ago)
Lifecycle Status 30 Weeks
Mount Surface Mount
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Number of Pins 4
Operating Temperature -40°C ~ 110°C
Packaging Bulk
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1
Number of Terminations 3
ECCN Code EAR99
Temperature Coefficient POSITIVE ppm/°C
Subcategory -
Voltage - Supply -
Base Part Number Vjxvlv Uhou
Output Voltage 36 V
Output Type N-Channel
Interface I2C, SPI
Termination Type SOLDER
Operating Supply Current 1.5 mA
Nominal Supply Current -
Output Current 20 mA
Max Supply Current 700 μA
Slew Rate -
Architecture VOLTAGE-FEEDBACK
Amplifier Type -
In-Stock:3164 items

About XPGBUTWTL1R25000FE7

The XPGBUTWTL1R25000FE7 from CREEINC is a high-performance microcontroller designed for a wide range of embedded applications. This component features XPGBUTWTL1R25000FE7 datasheet pdf and Backplanes product details from CREEINC stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the XPGBUTWTL1R25000FE7, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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