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REZ300.NB3P

REZ300.NB3P

REZ300.NB3P

HellermannTyton

REZ300.NB3P datasheet pdf and Cable Ties and Cable Lacing product details from HellermannTyton stock available on our website

SOT-23

REZ300.NB3P Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 9 Weeks
Mount Free Hanging
Mounting Type Free Hanging (In-Line)
Package / Case 100
Material Polyamide (PA66), Nylon 6/6
Body Material Polyamide
Packaging100 per Pkg
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Operating Temperature85°C
Min Operating Temperature -40°C
Color Black
Shielding Unshielded
Depth 4.7mm
Halogen Free Halogen Free
Wire/Cable Diameter 80 mm
Tensile Strength30 lbs (13.61 kg)
Wire/Cable Tie Type Standard, Pinch Releasable
Bundle Diameter3.15 (80.00mm)
Length 304.8mm
Width 0.185 4.70mm
Thickness 1.4mm
Length - Approximate 12
Length - Actual 1.000' 304.80mm
REACH SVHC Unknown
RoHS StatusRoHS Compliant
In-Stock:14828 items

Pricing & Ordering

QuantityUnit PriceExt. Price
100$0.47910$47.91
300$0.43743$131.229
500$0.41660$208.3

About REZ300.NB3P

The REZ300.NB3P from HellermannTyton is a high-performance microcontroller designed for a wide range of embedded applications. This component features REZ300.NB3P datasheet pdf and Cable Ties and Cable Lacing product details from HellermannTyton stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the REZ300.NB3P, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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