1.27mm mm FPGAs FLEX 6000 Series 100-TQFP 0.5mm mm 100
SOT-23
EPF6016ATI100-2N Datasheet PDF
non-compliant
Technical Specifications
Parameter Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
100-TQFP
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
FLEX 6000
JESD-609 Code
e3
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
100
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Additional Feature
ALSO CONFIGURABLE WITH 5V VCC
HTS Code
8542.39.00.01
Voltage - Supply
3V~3.6V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
3.3V
Terminal Pitch
0.5mm
Reach Compliance Code
compliant
[email protected] Reflow Temperature-Max (s)
40
Base Part Number
EPF6016
JESD-30 Code
S-PQFP-G100
Qualification Status
Not Qualified
Number of I/O
81
Clock Frequency
153MHz
Programmable Logic Type
LOADABLE PLD
Number of Logic Elements/Cells
1320
Number of Gates
16000
Number of LABs/CLBs
132
Output Function
MACROCELL
Number of Dedicated Inputs
4
Height Seated (Max)
1.27mm
Length
14mm
Width
14mm
RoHS Status
RoHS Compliant
In-Stock:3423 items
EPF6016ATI100-2N Product Details
EPF6016ATI100-2N Overview
Fpga chips is supplied in the 100-TQFP package. An FPGA of this type is made up of LOADABLE PLD gates. Having 81 I/Os makes data transfers more coherent. A fundamental building block consists of 1320 logic elements/cells. It is powered from a supply voltage of 3.3V. An FPGA module can be attached to a development board with a Surface Mount-pin. There is a 3V~3.6V-volt supply voltage required for the device to operate. An FPGA belonging to the FLEX 6000 series is referred to as an FPGA. The operating temperature should be kept at -40°C~100°C TJ when operating. Fpga chips is designed to maximiTraye space effic
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