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EP1M350F780C7ES

EP1M350F780C7ES

EP1M350F780C7ES

Intel

FPGAs Mercury Series 780-BBGA, FCBGA

SOT-23

EP1M350F780C7ES Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-FBGA (29x29)
Operating Temperature0°C~85°C TJ
PackagingTray
Series Mercury
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.71V~1.89V
Number of I/O 486
Number of Logic Elements/Cells 14400
Total RAM Bits 114688
Number of Gates350000
Number of LABs/CLBs 1440
In-Stock:2072 items

EP1M350F780C7ES Product Details

EP1M350F780C7ES Overview


In the 780-BBGA, FCBGA package, you will find fpga chips. Having 486 I/Os makes data transfers more coherent. Logic blocks consist of 14400 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Powered by a 1.71V~1.89V supply voltage, fpga chips is able to operate at high speeds. The Mercury series FPGA is a type of FPGA that belongs to the Mercury family of FPGAs. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. As a space-saving measure, this FPGA model is contained within Tray. This device is equipped with 114688 RAM bits in terms of its RAM si114688e. A total of 1440 LABs/CLBs are included in this FPGA. There are 350000 gates that make up its basic building block. There is a device package provided by 780-FBGA (29x29), which is the supplier.

EP1M350F780C7ES Features


486 I/Os
Up to 114688 RAM bits

EP1M350F780C7ES Applications


There are a lot of Intel EP1M350F780C7ES FPGAs applications.

  • Automotive advanced driver assistance systems (ADAS)
  • Telecommunication
  • Medical imaging
  • Data Mining
  • Aerospace and Defense
  • Audio
  • Data center hardware accelerators
  • Automation
  • ASIC prototyping
  • Broadcast

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