EPF10K50EBC356-1X Overview
In the 356-LBGA package, you will find fpga chips. The device has 246 I/O ports for more coherent data transfer. A fundamental building block is made up of 2880 logic elements/cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. Fpga chips operates wFpga chipsh a supply voltage of 4.75V~5.25V. The FLEX-10KE? Series is one of the types of FPGAs that belong to this type. While operating, the operating temperature should be kept within a range of 0°C~70°C TA. A model of this FPGA is contained in Tray for the purpose of saving space. The RAM bits that are offered by this fpga chips are 20480. An array of 360 LABs/CLBs is built into the FPGA. Fpga semiconductor is made up of 116000 gates as fpga semiconductors basic building block. The supplier of the device package is 356-BGA (35x35).
EPF10K50EBC356-1X Features
246 I/Os
Up to 20480 RAM bits
EPF10K50EBC356-1X Applications
There are a lot of Intel EPF10K50EBC356-1X FPGAs applications.
- Bioinformatics
- Military Temperature
- Software-defined radios
- Aerospace and Defense
- Solar Energy
- Server Applications
- Artificial intelligence (AI)
- Electronic Warfare
- Industrial IoT
- Consumer Electronics
