Welcome to Hotenda.com Online Store!

logo
userjoin
Home

EPF10K30ABC356-4

EPF10K30ABC356-4

EPF10K30ABC356-4

Intel

FPGAs FLEX-10KA? Series 356-LBGA

SOT-23

EPF10K30ABC356-4 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 356-LBGA
Supplier Device Package 356-BGA (35x35)
Operating Temperature0°C~70°C TA
PackagingTray
Series FLEX-10KA®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3V~3.6V
Number of I/O 246
Number of Logic Elements/Cells 1728
Total RAM Bits 12288
Number of Gates69000
Number of LABs/CLBs 216
In-Stock:2380 items

EPF10K30ABC356-4 Product Details

EPF10K30ABC356-4 Overview


In the package 356-LBGA, this product is provided. There are 246 I/Os for better data transfer. To form a fundamental building block, there are 1728 logic elements/cells. FPGA modules can be attached to development boards using a Surface Mount-connector. Powered by a 3V~3.6V supply voltage, fpga chips is able to operate at high speeds. It is a type of FPGA that belongs to the FLEX-10KA? series of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~70°C TA at all times. As a result of space limitations, this FPGA model has been included in Tray. The RAM bits that are offered by this fpga chips are 12288. 216 LABs/CLBs are configured on this FPGA. 69000 gates make up the basic block of its construction. It employs 356-BGA (35x35) as its supplier device package.

EPF10K30ABC356-4 Features


246 I/Os
Up to 12288 RAM bits

EPF10K30ABC356-4 Applications


There are a lot of Intel EPF10K30ABC356-4 FPGAs applications.

  • Military Temperature
  • Integrating multiple SPLDs
  • Computer hardware emulation
  • ADAS
  • Embedded Vision
  • Server Applications
  • Electronic Warfare
  • Medical Applications
  • Image processing
  • Data Mining

Get Subscriber

Enter Your Email Address, Get the Latest News