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EP3C55F484C8N

EP3C55F484C8N

EP3C55F484C8N

Intel

2.6mm mm FPGAs Cyclone? III Series 484-BGA 1mm mm 484

SOT-23

EP3C55F484C8N Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 484-BGA
Surface MountYES
Operating Temperature0°C~85°C TJ
PackagingTray
Series Cyclone® III
JESD-609 Code e1
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
ECCN Code 3A991
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.15V~1.25V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch1mm
[email protected] Reflow Temperature-Max (s) 40
Base Part Number EP3C55
JESD-30 Code R-PBGA-B484
Number of Outputs 327
Qualification StatusNot Qualified
Number of I/O 327
Clock Frequency 472.5MHz
Number of Inputs 327
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 55856
Total RAM Bits 2396160
Number of LABs/CLBs 3491
Height Seated (Max) 2.6mm
Length 23mm
Width 23mm
RoHS StatusRoHS Compliant
In-Stock:4249 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$176.87000$176.87

EP3C55F484C8N Product Details

EP3C55F484C8N Description


EP3C55F484C8N FPGA developed by Intel is a member of Cyclone III device family featuring a unique combination of high functionality, low power and low cost. Power consumption can be achieved based on silicon optimizations and software features delivered by TSMC low-power (LP) process technology and Altera® power-aware design flow, making this device well suited for high-volume, low-power, and cost-sensitive applications.



EP3C55F484C8N Features


Low-power operation

Lowest power consumption

High memory-to-logic and multiplier-to-logic ratio

Hot-socketing operation support



EP3C55F484C8N Applications


High-volume, low-power, and cost-sensitive applications


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