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EPF10K200EF672-1

EPF10K200EF672-1

EPF10K200EF672-1

Intel

FPGAs FLEX-10KE? Series 672-BBGA

SOT-23

EPF10K200EF672-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 672-BBGA
Supplier Device Package 672-FBGA (27x27)
Operating Temperature0°C~70°C TA
PackagingTray
Series FLEX-10KE®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 2.3V~2.7V
Number of I/O 470
Number of Logic Elements/Cells 9984
Total RAM Bits 98304
Number of Gates513000
Number of LABs/CLBs 1248
In-Stock:3646 items

EPF10K200EF672-1 Product Details

EPF10K200EF672-1 Overview


There are two packages that contain fpga chips: 672-BBGA package and X package. Fpga chips is programmed wFpga chipsh 470 I/Os for transferring data in a more coherent manner. Logic blocks consist of 9984 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. In order for it to operate, the supply voltage must be 2.3V~2.7V . An FPGA belonging to the FLEX-10KE? series is referred to as an FPGA. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~70°C TA when operating the machine. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. The RAM bits that this device offer is 98304. This FPGA is built as an array of 1248 LABs/CLBs. There are 513000 gates that make up its basic building block. The supplier of the device package is 672-FBGA (27x27).

EPF10K200EF672-1 Features


470 I/Os
Up to 98304 RAM bits

EPF10K200EF672-1 Applications


There are a lot of Intel EPF10K200EF672-1 FPGAs applications.

  • Data Mining
  • Automotive Applications
  • DO-254
  • Industrial IoT
  • Medical Applications
  • Cryptography
  • Video & Image Processing
  • ADAS
  • Audio
  • Telecommunication

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