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EP2AGX65DF29C6NES

EP2AGX65DF29C6NES

EP2AGX65DF29C6NES

Intel

FPGAs Arria II GX Series 780-BBGA, FCBGA

SOT-23

EP2AGX65DF29C6NES Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-FBGA (29x29)
Operating Temperature0°C~85°C TJ
PackagingTray
Series Arria II GX
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Base Part Number EP2AGX65
Number of I/O 364
Number of Logic Elements/Cells 60214
Total RAM Bits 5371904
Number of LABs/CLBs 2530
In-Stock:3159 items

EP2AGX65DF29C6NES Product Details

EP2AGX65DF29C6NES Overview


There are two packages that contain fpga chips: 780-BBGA, FCBGA package and X package. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block is made up of 60214 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. With a supply voltage of 0.87V~0.93V, this device operates with ease. The Arria II GX Series is one of the types of FPGAs that belong to this type. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. There is an FPGA model contained in Tray in order to conserve space. A device like this one offers 5371904 RAM bits, which is a considerable amount of memory. For related parts, use its base part number EP2AGX65. Fpga electronics contains 2530 LABs/CLBs in an array. Its supplier package is called 780-FBGA (29x29).

EP2AGX65DF29C6NES Features


364 I/Os
Up to 5371904 RAM bits

EP2AGX65DF29C6NES Applications


There are a lot of Intel EP2AGX65DF29C6NES FPGAs applications.

  • Data center search engines
  • Voice recognition
  • Security systems
  • Software-defined radio
  • OpenCL
  • Space Applications
  • Image processing
  • Computer hardware emulation
  • Scientific Instruments
  • Device controllers

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