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EPF6024AFI256-2

EPF6024AFI256-2

EPF6024AFI256-2

Intel

FPGAs FLEX 6000 Series 256-BGA

SOT-23

EPF6024AFI256-2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-FBGA (17x17)
Operating Temperature-40°C~100°C TJ
PackagingTray
Series FLEX 6000
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3V~3.6V
Base Part Number EPF6024
Number of I/O 219
Number of Logic Elements/Cells 1960
Number of Gates24000
Number of LABs/CLBs 196
RoHS StatusNon-RoHS Compliant
In-Stock:4019 items

EPF6024AFI256-2 Product Details

EPF6024AFI256-2 Overview


This package is included in the 256-BGA package and is available for purchase. A total of 219 I/Os are programmed to ensure a more coherent data transfer. Logic elements/cells form the fundamental building block of a computer. Surface Mount-connectors can be used to attach this FPGA module to the development board. The supply voltage of the device is 3V~3.6V , at which it runs. An FPGA belonging to the FLEX 6000 series is referred to as an FPGA. The operating temperature should be kept at -40°C~100°C TJ when operating. A model of this FPGA is contained in Tray for the purpose of saving space. Its base part number EPF6024 can be used to find parts that are related to it. The FPGA is built as an array of 196 latches or CLBs. 24000 gates make up the basic block of its construction. Device package 256-FBGA (17x17) is provided by its supplier.

EPF6024AFI256-2 Features


219 I/Os

EPF6024AFI256-2 Applications


There are a lot of Intel EPF6024AFI256-2 FPGAs applications.

  • Software-defined radios
  • Software-defined radio
  • Enterprise networking
  • Bioinformatics
  • Server Applications
  • Electronic Warfare
  • Security systems
  • Military DSP
  • Radar and Sensors
  • Data Mining

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