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EP2AGX190EF29I3G

EP2AGX190EF29I3G

EP2AGX190EF29I3G

Intel

FPGAs Arria II GX Series 780-BBGA, FCBGA

SOT-23

EP2AGX190EF29I3G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-FBGA (29x29)
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Arria II GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Number of I/O 372
Number of Logic Elements/Cells 181165
Total RAM Bits 10177536
Number of LABs/CLBs 7612
RoHS StatusRoHS Compliant
In-Stock:4479 items

Pricing & Ordering

QuantityUnit PriceExt. Price

EP2AGX190EF29I3G Product Details

EP2AGX190EF29I3G Overview


In the package 780-BBGA, FCBGA, this product is provided. This device features 372 I/Os in order to transfer data in a more efficient manner. A fundamental building block contains 181165 logic elements or cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. Fpga chips operates at a voltage of 0.87V~0.93V and uses a battery to supply power. The FPGA belongs to the Arria II GX series of FPGAs, and it is one type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. As a space-saving measure, this FPGA model is contained within Tray. The RAM bits that are offered by this fpga chips are 10177536. The FPGA is built as an array of 7612 latches or CLBs. The supplier of the device package is 780-FBGA (29x29).

EP2AGX190EF29I3G Features


372 I/Os
Up to 10177536 RAM bits

EP2AGX190EF29I3G Applications


There are a lot of Intel EP2AGX190EF29I3G FPGAs applications.

  • Image processing
  • Wireless Communications
  • Military Temperature
  • DO-254
  • Aerospace and Defense
  • Audio
  • Industrial,Medical and Scientific Instruments
  • Automotive advanced driver assistance systems (ADAS)
  • Data Center
  • Electronic Warfare

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