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EP1S30F780C6DM

EP1S30F780C6DM

EP1S30F780C6DM

Intel

FPGAs Stratix? Series 780-BBGA, FCBGA

SOT-23

EP1S30F780C6DM Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-FBGA (29x29)
Operating Temperature0°C~85°C TJ
PackagingTray
Series Stratix®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.425V~1.575V
Number of I/O 597
Number of Logic Elements/Cells 32470
Total RAM Bits 3317184
Number of LABs/CLBs 3247
In-Stock:2107 items

EP1S30F780C6DM Product Details

EP1S30F780C6DM Overview


This package is included in the 780-BBGA, FCBGA package and is available for purchase. This device features 597 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 32470 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. The supply voltage of the device is 1.425V~1.575V , at which it runs. The Stratix? series FPGA is a type of FPGA that belongs to the Stratix? family of FPGAs. The operating temperature should be kept at 0°C~85°C TJ when operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. This device has 3317184 RAM bits, which is the number of RAM bits that this device offers. 3247 LABs/CLBs are integrated into this FPGA. The device package supplied by 780-FBGA (29x29) is one of its suppliers.

EP1S30F780C6DM Features


597 I/Os
Up to 3317184 RAM bits

EP1S30F780C6DM Applications


There are a lot of Intel EP1S30F780C6DM FPGAs applications.

  • Enterprise networking
  • Broadcast
  • Device controllers
  • Wired Communications
  • Military Temperature
  • Software-defined radio
  • Space Applications
  • Industrial Ethernet
  • High Performance Computing
  • Radar and Sensors

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