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EP3SL50F780C3G

EP3SL50F780C3G

EP3SL50F780C3G

Intel

FPGAs Stratix? III L Series 780-BBGA, FCBGA

SOT-23

EP3SL50F780C3G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Operating Temperature0°C~85°C TJ
Series Stratix® III L
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.86V~1.15V
Number of I/O 488
Number of Logic Elements/Cells 47500
Total RAM Bits 2184192
Number of LABs/CLBs 1900
RoHS StatusRoHS Compliant
In-Stock:2373 items

EP3SL50F780C3G Product Details

EP3SL50F780C3G Overview


A 780-BBGA, FCBGA package is provided with this component. This device features 488 I/Os in order to transfer data in a more efficient manner. In order to construct a fundamental building block, 47500 logic elements/cells are required. With a Surface Mount connector, this FPGA module can be attached to the development board. Fpga chips operates at a voltage of 0.86V~1.15V and uses a battery to supply power. The FPGA belongs to the Stratix? III L series of FPGAs, and it is one type of FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 2184192 bFpga chipss. An array of 1900 LABs/CLBs is built into the FPGA.

EP3SL50F780C3G Features


488 I/Os
Up to 2184192 RAM bits

EP3SL50F780C3G Applications


There are a lot of Intel EP3SL50F780C3G FPGAs applications.

  • Embedded Vision
  • Artificial intelligence (AI)
  • Data Mining
  • Security systems
  • Automotive advanced driver assistance systems (ADAS)
  • Ecosystem
  • Military DSP
  • Camera time adjustments
  • Solar Energy
  • Cryptography

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