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CENGPXA270-416-10-550EIR

CENGPXA270-416-10-550EIR

CENGPXA270-416-10-550EIR

Logic

CENGPXA270-416-10-550EIR datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Logic stock available on our website

SOT-23

CENGPXA270-416-10-550EIR Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Operating Temperature-40°C~85°C
Published 2007
Size / Dimension 2.37 x 2.67 60.2mmx67.8mm
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type SO-DIMM-144
Max Operating Temperature85°C
Min Operating Temperature -40°C
Frequency 416MHz
Speed 416MHz
RAM Size 64MB
Core Processor PXA270
Module/Board Type MCU Core
Flash Size 64MB
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:4198 items

CENGPXA270-416-10-550EIR Product Details

CENGPXA270-416-10-550EIR Overview


A MCU Core module or board is used in the microcontroller.There are PXA270 cores in the processor.-40°C~85°C is the default setting for the microcontroller.The size of the flash on the MCU electronics is 64MB.The connector type SO-DIMM-144 refers to the connector type.The RAM is reduced to 64MB in order to ensure that the software is able to run normally.During operation, the MCU chip moves at 416MHz speed.At a frequency of 416MHz, MCU chip can continue to function accurately.At this time, 85°C is the maximum temperature that can be operated at.When operating, microprocessor should be warmer than -40°C.

CENGPXA270-416-10-550EIR Features


Core processor of PXA270
Flash size of 64MB
Speed of 416MHz

CENGPXA270-416-10-550EIR Applications


There are a lot of Logic CENGPXA270-416-10-550EIR Microcontroller, Microprocessor, FPGA Modules applications.

  • Medical Instrumentation
  • Medical Devices
  • Test and Measurement
  • Industrial Control
  • Home and Building Automation
  • Thermostat
  • Portable Data Terminals
  • Industrial Instrumentation
  • Embedded Control Processing
  • Power Protection Systems

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