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1SG085HN3F43I2LG

1SG085HN3F43I2LG

1SG085HN3F43I2LG

Intel

FPGAs Stratix? 10 GX Series 1760-BBGA, FCBGA

SOT-23

1SG085HN3F43I2LG Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 1760-BBGA, FCBGA
Operating Temperature-40°C~100°C TJ
Series Stratix® 10 GX
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.82V~0.88V
Number of I/O 688
Number of Logic Elements/Cells 850000
Number of LABs/CLBs 106250
In-Stock:2146 items

1SG085HN3F43I2LG Product Details

1SG085HN3F43I2LG Overview


This package is included in the 1760-BBGA, FCBGA package and is available for purchase. A total of 688 I/Os are programmed to ensure a more coherent data transfer. In order to construct a fundamental building block, 850000 logic elements/cells are required. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 0.82V~0.88V and uses a battery to supply power. FPGAs belonging to the Stratix? 10 GX series are a type of FPGA that belong to the Stratix? 10 GX series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. The FPGA consists of 106250 LABs/CLBs.

1SG085HN3F43I2LG Features


688 I/Os

1SG085HN3F43I2LG Applications


There are a lot of Intel 1SG085HN3F43I2LG FPGAs applications.

  • DO-254
  • Artificial intelligence (AI)
  • Telecommunication
  • Software-defined radios
  • Development Boards and Shields for Microcontrollers
  • Broadcast
  • Voice recognition
  • Server Applications
  • Random logic
  • Medical Electronics

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