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0874370263

0874370263

0874370263

Molex

CONN HEADER SMD 2POS 1.5MM

SOT-23

0874370263 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 20 Weeks
Contact MaterialBrass Alloy
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Polyamide (PA), Nylon, Glass Filled
PackagingTape & Reel (TR)
Series Pico-SPOX 87437
Feature Pick and Place
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 2
Applications General Purpose, Medical
Number of Rows 1
Fastening TypePush-Pull
Contact Finish - Mating Tin
Contact Type Male Pin
Insulation Height 0.199 5.05mm
Style Board to Cable/Wire
Number of Positions Loaded All
Pitch - Mating 0.059 1.50mm
Insulation Color Black
Shrouding Shrouded - 4 Wall
Contact Length - Mating 0.106 2.70mm
Contact Finish Thickness - Mating 100.0μin 2.54μm
Stack Height (Mating) 7.4mm
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:7753 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.914341$0.914341
10$0.862587$8.62587
100$0.813761$81.3761
500$0.767699$383.8495
1000$0.724244$724.244

About 0874370263

The 0874370263 from Molex is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN HEADER SMD 2POS 1.5MM.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 0874370263, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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