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BP800-0.005-00-1212

BP800-0.005-00-1212

BP800-0.005-00-1212

Bergquist

THERM PAD 304.8MMX304.8MM W/ADH

SOT-23

BP800-0.005-00-1212 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Material Acrylic
Shape Square
Series Bond-Ply® 800
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Sheet, Tape
Color Granite
Adhesive Adhesive - Both Sides
Backing, Carrier Fiberglass
Outline 304.80mm x 304.80mm
Thermal Conductivity0.8W/m-K
Thickness 0.0050 0.127mm
RoHS StatusROHS3 Compliant
In-Stock:339 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$21.40000$21.4
10$19.68300$196.83
50$17.11600$855.8
100$14.54860$1454.86
500$11.98120$5990.6

About BP800-0.005-00-1212

The BP800-0.005-00-1212 from Bergquist is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERM PAD 304.8MMX304.8MM W/ADH.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BP800-0.005-00-1212, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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