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K4-0.006-AC-54

K4-0.006-AC-54

K4-0.006-AC-54

Bergquist

THERM PAD 19.05MMX12.7MM W/ADH

SOT-23

K4-0.006-AC-54 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Material Silicone Rubber
Shape Rectangular
Series Sil-Pad® K-4
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Pad, Sheet
Color Gray
Usage TO-220
Shelf Life 6 Months
Adhesive Adhesive - One Side
Backing, Carrier Polyimide
Outline 19.05mm x 12.70mm
Thermal Conductivity0.9W/m-K
Natural Thermal Resistance 0.48 °C/W
Thickness 0.0060 0.152mm
RoHS StatusROHS3 Compliant
In-Stock:16890 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About K4-0.006-AC-54

The K4-0.006-AC-54 from Bergquist is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERM PAD 19.05MMX12.7MM W/ADH.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the K4-0.006-AC-54, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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