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BP100-0.011-00-1010

BP100-0.011-00-1010

BP100-0.011-00-1010

Bergquist

BP100-0.011-00-1010 datasheet pdf and Thermal - Pads, Sheets product details from Bergquist stock available on our website

SOT-23

BP100-0.011-00-1010 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Material Polyimide
Shape Square
Series Bond-Ply® 100
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Sheet, Tape
Color White
Adhesive Adhesive - Both Sides
Backing, Carrier Fiberglass
Outline 254.00mm x 254.00mm
Thermal Conductivity0.8W/m-K
Natural Thermal Resistance 1.01 °C/W
Thermal Resistivity1.01°C/W
Thickness 0.0110 0.279mm
RoHS StatusROHS3 Compliant
In-Stock:320 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$18.70000$18.7
10$17.60000$176
50$16.50000$825
100$15.40000$1540
500$14.30000$7150

About BP100-0.011-00-1010

The BP100-0.011-00-1010 from Bergquist is a high-performance microcontroller designed for a wide range of embedded applications. This component features BP100-0.011-00-1010 datasheet pdf and Thermal - Pads, Sheets product details from Bergquist stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BP100-0.011-00-1010, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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