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A17633-18

A17633-18

A17633-18

Laird Technologies - Thermal Materials

A17633-18 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website

SOT-23

A17633-18 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone, Ceramic Filled
Shape Square
Series Tflex™ HD300
Published 2018
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Color Pink
Adhesive Tacky - Both Sides
Outline 228.60mm x 228.60mm
Thermal Conductivity2.7W/m-K
Thickness 0.180 4.57mm
RoHS StatusRoHS Compliant
In-Stock:96 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$107.46000$107.46
10$101.27800$1012.78
25$95.10160$2377.54
50$92.01400$4600.7
100$88.92630$8892.63

About A17633-18

The A17633-18 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features A17633-18 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A17633-18, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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