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TPSBUT226K010Y0400

TPSBUT226K010Y0400

TPSBUT226K010Y0400

AVXCORPORATION

TPSBUT226K010Y0400 datasheet pdf and Backplanes product details from AVXCORPORATION stock available on our website

SOT-23

TPSBUT226K010Y0400 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 6 days ago)
Lifecycle Status 11 Weeks
Mount Flanges
Mounting Type Through Hole
Package / Case SOIC
Number of Pins 3
Operating Temperature -55°C ~ 150°C
Packaging Tape & Reel (TR)
Pbfree Code -
Part Status Obsolete
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 3
ECCN Code -
Temperature Coefficient POSITIVE ppm/°C
Subcategory Other Sensors/Transducers
Voltage - Supply 4V ~ 30V
Base Part Number Oayyx Qfwe
Output Voltage 33 V
Output Type N-Channel
Interface I2C, SPI
Termination Type SOLDER
Operating Supply Current 800 μA
Nominal Supply Current 80 μA
Output Current 30 mA
Max Supply Current 10 mA
Slew Rate 0.1V/μs
Architecture VOLTAGE-FEEDBACK
Amplifier Type OPERATIONAL AMPLIFIER
In-Stock:3606 items

About TPSBUT226K010Y0400

The TPSBUT226K010Y0400 from AVXCORPORATION is a high-performance microcontroller designed for a wide range of embedded applications. This component features TPSBUT226K010Y0400 datasheet pdf and Backplanes product details from AVXCORPORATION stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the TPSBUT226K010Y0400, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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