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AGP 25 G-NEW

AGP 25 G-NEW

AGP 25 G-NEW

Assmann WSW Components

CONN BACKSHELL 25POS 180DEG BLK

SOT-23

AGP 25 G-NEW Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 23 Weeks
Material Acrylonitrile Butadiene Styrene (ABS)
Published 2006
Feature Mating Screws
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Positions 25
Color Black
Shielding Unshielded
Cable TypeRound
Accessory Type Two Piece Backshell
Cable Exit 180°
Hardware Assembly Hardware, Strain Relief
RoHS StatusROHS3 Compliant
In-Stock:6034 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.204957$1.204957
10$1.136753$11.36753
100$1.072408$107.2408
500$1.011705$505.8525
1000$0.954439$954.439

About AGP 25 G-NEW

The AGP 25 G-NEW from Assmann WSW Components is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN BACKSHELL 25POS 180DEG BLK.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the AGP 25 G-NEW, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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