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5745174-2

5745174-2

5745174-2

TE Connectivity AMP Connectors

CONN BACKSHELL 37POS 180DEG SHLD

SOT-23

5745174-2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 29 Weeks
Lifecycle Status ACTIVE (Last Updated: 5 months ago)
Material Metal, Zinc Alloy
Published 2007
Series AMPLIMITE
Feature Mating Screws 4-40
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type Connector
Number of Positions 37
Max Operating Temperature105°C
Min Operating Temperature -55°C
Color Silver
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Shielding Shielded
Depth 48.76mm
ELV Compliant
Plating Nickel over Copper
Cable TypeRound
Accessory Type Two Piece Backshell
Wire/Cable Diameter 14.605 mm
Cable Exit 180°
Assembly Item Name CABLE CLAMP
Hardware Assembly Hardware, Strain Relief
Height 20.32mm
Length 69.54mm
Width 20.32mm
REACH SVHC Unknown
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:529 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$16.190000$16.19
10$15.273585$152.73585
100$14.409042$1440.9042
500$13.593436$6796.718
1000$12.823996$12823.996

About 5745174-2

The 5745174-2 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN BACKSHELL 37POS 180DEG SHLD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 5745174-2, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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