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BLP10H603Z

BLP10H603Z

BLP10H603Z

Ampleon USA Inc.

RF FET LDMOS 104V 22DB 12VDFN

SOT-23

BLP10H603Z Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 13 Weeks
Package / Case 12-VDFN Exposed Pad
Surface MountYES
Transistor Element Material SILICON
PackagingTape & Reel (TR)
Published 2011
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 12
ECCN Code EAR99
Voltage - Rated 104V
Terminal Position DUAL
Terminal FormNO LEAD
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code unknown
Frequency 860MHz
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Reference Standard IEC-60134
JESD-30 Code R-PDSO-N12
Number of Elements 1
Configuration SINGLE
Operating ModeENHANCEMENT MODE
Case Connection SOURCE
Current - Test 15mA
Transistor Application AMPLIFIER
Polarity/Channel Type N-CHANNEL
Transistor Type LDMOS
JEDEC-95 Code MO-229
Gain 22.8dB
DS Breakdown Voltage-Min 104V
Power - Output 2.5W
FET Technology METAL-OXIDE SEMICONDUCTOR
Voltage - Test 50V
RoHS StatusROHS3 Compliant
In-Stock:585 items

Pricing & Ordering

QuantityUnit PriceExt. Price
500$12.86512$6432.56

About BLP10H603Z

The BLP10H603Z from Ampleon USA Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features RF FET LDMOS 104V 22DB 12VDFN.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BLP10H603Z, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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