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189658F00000

189658F00000

189658F00000

Aavid, Thermal Division of Boyd Corporation

THERM PAD 19.05MMX12.7MM W/ADH

SOT-23

189658F00000 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Adhesive
Material Silicone
Shape Rectangular
Series In-Sil-8
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Pad, Sheet
Color Gray
Usage TO-218, TO-220, TO-247
Adhesive Adhesive - One Side
Outline 19.05mm x 12.70mm
Natural Thermal Resistance 0.93 °C/W
Thermal Resistivity1.40°C/W, 0.93°C/W
Thickness 0.0060 0.152mm
RoHS StatusNon-RoHS Compliant
In-Stock:3821 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 189658F00000

The 189658F00000 from Aavid, Thermal Division of Boyd Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERM PAD 19.05MMX12.7MM W/ADH.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 189658F00000, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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