Welcome to Hotenda.com Online Store!

logo
userjoin
Home

A16365-11

A16365-11

A16365-11

Laird Technologies - Thermal Materials

A16365-11 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website

SOT-23

A16365-11 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Material Elastomer
Shape Square
Series Tflex™ XS400
Published 2011
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Color Gray
Adhesive Tacky - Both Sides
Backing, Carrier Liner
Outline 228.60mm x 228.60mm
Thermal Conductivity2.0W/m-K
Thickness 0.110 2.79mm
RoHS StatusRoHS Compliant
In-Stock:1103 items

About A16365-11

The A16365-11 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features A16365-11 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A16365-11, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

Get Subscriber

Enter Your Email Address, Get the Latest News