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MH10-10FLK

MH10-10FLK

MH10-10FLK

3M

MH10-10FLK datasheet pdf and Terminals - Spade Connectors product details from 3M stock available on our website

SOT-23

MH10-10FLK Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Contact MaterialCopper, ETP
Contact PlatingTin
Mount Free Hanging
Mounting Type Free Hanging (In-Line)
Weight 453.59237g
Material - Insulation Polyolefin
Body Material Copper
PackagingBulk
Series Scotchlok™
Published 2002
Feature Brazed Seam
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Crimp
Color Yellow
Gender Male
Voltage - Rated 600V
Voltage - Rated DC 600V
Depth 8.12mm
Wire Gauge10-12 AWG
Wire Gauge (Max) 12 AWG
Wire Gauge (Min) 10 AWG
Insulation Insulated with Heat Shrink
Terminal TypeSpring, Snap
Stud/Tab Size 10 Stud
Length 25.4mm
Length - Termination 0.640 16.26mm
Length - Overall 1.000 25.40mm
Width - Outer Edges 0.320 8.13mm
Length - Ring Center to Termination 0.160 4.06mm
RoHS StatusRoHS Compliant
In-Stock:9065 items

Pricing & Ordering

QuantityUnit PriceExt. Price
250$0.82980$207.45

About MH10-10FLK

The MH10-10FLK from 3M is a high-performance microcontroller designed for a wide range of embedded applications. This component features MH10-10FLK datasheet pdf and Terminals - Spade Connectors product details from 3M stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MH10-10FLK, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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