EPF6016BI256-3 Overview

There are two packages that contain fpga chips: 256-LBGA package and X package. In this kind of FPGA, LOADABLE PLD is used. Its 204 I/Os help it transfer data more efficiently. A fundamental building block consists of 1320 logic elements/cells. In order to operate fpga chips, a voltage supply of 5V volts is required. A Field Programmable Gate Arrays-series FPGA part. This FPGA module can be attached to the development board with a Surface Mount. This device is powered by a 4.75V~5.25V battery. It is a type of FPGA belonging to the FLEX 6000 seies. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. In this device, there are 204 outputs that can be used. There is an FPGA model contained in Tray in order to conserve space. In total, it has 256 terminations on each end. The FPGA consists of 132 LABs/CLBs. Powered by a 3.3/55V power supply, it can be operated by almost anyone. 16000 gates make up the basic block of its construction. It usually uses a 133MHz crystal. Furthermore, it can be distinguished by the presence of a feature called ALSO CONFIGURABLE WITH 5V VCC. To detect the status of input signals, there is a dedicated input which is used to detect the status of the input module.

EPF6016BI256-3 Features

204 I/Os

EPF6016BI256-3 Applications

There are a lot of Intel EPF6016BI256-3 FPGAs applications.

• ASIC prototyping
• Industrial,Medical and Scientific Instruments
• Industrial IoT
• Audio
• Video & Image Processing
• OpenCL
• Software-defined radio
• Ecosystem
• Defense Applications
• Data center hardware accelerators