EP3SL70F780I4G Overview

Fpga chips is supplied in the 780-BBGA package. A total of 488 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block consists of 67500 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. In order to operate it, it requires a voltage supply of 0.86V~1.15V . As part of the Stratix? III L series of FPGAs, it is a type of FPGA. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. A model of this FPGA is contained in Tray for the purpose of saving space. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 2699264 bFpga chipss. This FPGA is built as an array of 2700 LABs/CLBs. 780-FBGA (29x29) stands for its supplier device package.

EP3SL70F780I4G Features

488 I/Os
Up to 2699264 RAM bits

EP3SL70F780I4G Applications

There are a lot of Intel EP3SL70F780I4G FPGAs applications.

• OpenCL
• Data Mining
• Software-defined radios
• Computer hardware emulation
• Secure Communication
• Audio
• Image processing
• Data center hardware accelerators
• Bioinformatics
• Industrial IoT