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10CX085YU484E5G

10CX085YU484E5G

10CX085YU484E5G

Intel

FPGAs 484-FBGA 484

SOT-23

10CX085YU484E5G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Mounting Type Surface Mount
Package / Case 484-FBGA
Surface MountYES
Operating Temperature0°C~100°C TJ
PackagingTray
Part StatusActive
Number of Terminations 484
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.9V
Reach Compliance Code compliant
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Supply Voltage-Max (Vsup) 0.93V
Supply Voltage-Min (Vsup) 0.87V
Number of I/O 208
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 85000
Total RAM Bits 5959680
Number of LABs/CLBs 31000
RoHS StatusRoHS Compliant
In-Stock:3287 items

Pricing & Ordering

QuantityUnit PriceExt. Price
84$108.16071$9085.49964

10CX085YU484E5G Product Details

10CX085YU484E5G Overview


There are two packages that contain fpga chips: 484-FBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. This device features 208 I/Os in order to transfer data in a more efficient manner. A fundamental building block consists of 85000 logic elements/cells. The supply voltage is 0.9V volts. By attaching the Surface Mount connector, you can use this FPGA module with your development board. During the operation of the system, the operating temperature should remain within the range of 0°C~100°C TJ. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has 484 terminations on each end. There are 5959680 RAM bits that are available with this device. 31000 LABs and CLBs are built into this FPGA. It is recommended that the supply voltage be greater than 0.87V to keep this FPGA functioning.

10CX085YU484E5G Features


208 I/Os
Up to 5959680 RAM bits

10CX085YU484E5G Applications


There are a lot of Intel 10CX085YU484E5G FPGAs applications.

  • Development Boards and Shields for Microcontrollers
  • Military Temperature
  • Wireless Communications
  • Image processing
  • Data Center
  • ADAS
  • Filtering and communication encoding
  • Voice recognition
  • Automotive driver's assistance
  • Enterprise networking

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