EP3C40F324C7N Overview

There are two packages that contain fpga chips: 324-BGA package and X package. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. Having 195 I/Os makes data transfers more coherent. A fundamental building block is made up of 39600 logic elements/cells. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. A Field Programmable Gate Arrays-series FPGA part. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.15V~1.25V battery. The Cyclone? III Series is one of the types of FPGAs that belong to this type. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. The device has 195 outputs that are integrated into it. This FPGA model is contained in Tray for space saving. In total, it has 324 terminations on each end. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 1161216 bFpga chipss. Parts related to this part can be found using its base part number EP3C40. An array of 2475 LABs/CLBs is built into the FPGA. Usually, fpga semiconductor uses a 472.5MHz crystal.

EP3C40F324C7N Features

195 I/Os
Up to 1161216 RAM bits

EP3C40F324C7N Applications

There are a lot of Intel EP3C40F324C7N FPGAs applications.

• Medical imaging
• Telecommunication
• Radar and Sensors
• Device controllers
• Automotive
• Software-defined radios
• Medical Applications
• Artificial intelligence (AI)
• Security systems
• Military Temperature