EPF10K250EFC672-3 Overview
There is a 672-BBGA package that includes this component. This kind of FPGA is composed of LOADABLE PLD. Fpga chips is programmed wFpga chipsh 470 I/Os for transferring data in a more coherent manner. It is powered from a supply voltage of 2.5V. FPGA parts like this belong to the Field Programmable Gate Arrays family. Surface Mount-connectors can be used to attach this FPGA module to the development board. There are many types of FPGAs in the FLEX-10KE? series, this is one of them. During the installation of this device, 470 outputs were incorporated. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga chips is designed wFpga chipsh 672 terminations. An external power supply of 2.52.5/3.3V is required to power the device. It incorporates 12160 logic cells used for the building block. To detect the status of input signals, there is a dedicated input which is used to detect the status of the input module. For this FPGA to function properly, the supply voltage must be greater than 2.3V. Fpga circuit is recommended that the operating temperature should not exceed 70°C degrees centigrade.
EPF10K250EFC672-3 Features
470 I/Os
EPF10K250EFC672-3 Applications
There are a lot of Intel EPF10K250EFC672-3 FPGAs applications.
- Server Applications
- Wired Communications
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Industrial Ethernet
- Data center hardware accelerators
- Enterprise networking
- Consumer Electronics
- Military Temperature
