EP2C70F896C6 Overview

There are two packages that contain fpga chips: 896-BGA package and X package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block contains 68416 logic elements or cells. It is powered from a supply voltage of 1.2V. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. By attaching the Surface Mount connector, you can use this FPGA module with your development board. This device is powered by a 1.15V~1.25V battery. It is a type of FPGA belonging to the Cyclone? II seies. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. This device is equipped with 606 separate outputs, which makes it a very versatile device. This FPGA model is contained in Tray for space saving. The total number of terminations is 896. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 1152000 bFpga chipss. Its base part number EP2C70 can be used to find related parts. 4276 LABs/CLBs are integrated into this FPGA. Power is provided by a 1.21.5/3.33.3V battery that is included with the device. Most of the time, it uses a crystal oscillating at 500MHz to generate the signal. A feature of this system is also called ALSO REQUIRES 3.3 SUPPLY, which gives it a unique characteristic.

EP2C70F896C6 Features

622 I/Os
Up to 1152000 RAM bits

EP2C70F896C6 Applications

There are a lot of Intel EP2C70F896C6 FPGAs applications.

• Aircraft navigation
• Image processing
• Consumer Electronics
• Embedded Vision
• Wired Communications
• Computer hardware emulation
• Scientific Instruments
• Medical ultrasounds
• Integrating multiple SPLDs
• Automotive driver's assistance