10M16DCU324I7G Overview

There are two packages that contain fpga chips: 324-LFBGA package and X package. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. This device features 246 I/Os in order to transfer data in a more efficient manner. There are 16000 logic elements/cells to form a fundamental building block. The supply voltage is 1.2V volts. The Field Programmable Gate Arrays family of FPGA parts includes this part. The Surface Mount-slot on the development board allows you to attach the FPGA module. The supply voltage of the device is 1.15V~1.25V , at which it runs. This is a type of FPGA that is part of the MAX? 10 series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. This device is equipped with 246 separate outputs, which makes it a very versatile device. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. In total, it has 324 terminations on each end. There are 562176 RAM bits that are available with this device. 1000 LABs and CLBs are built into this FPGA. The device runs on a 1.2V battery and requires no additional power supply to operate.

10M16DCU324I7G Features

246 I/Os
Up to 562176 RAM bits

10M16DCU324I7G Applications

There are a lot of Intel 10M16DCU324I7G FPGAs applications.

• Computer hardware emulation
• Medical imaging
• Automotive
• Cryptography
• Device controllers
• Industrial IoT
• Embedded Vision
• Radar and Sensors
• Space Applications
• Camera time adjustments