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10AX115N4F45I3SGE2

10AX115N4F45I3SGE2

10AX115N4F45I3SGE2

Intel

3.5mm mm FPGAs Arria 10 GX Series 1932-BBGA, FCBGA 1mm mm

SOT-23

10AX115N4F45I3SGE2 Datasheet

non-compliant

In-Stock: 1902 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 1932-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria 10 GX
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.87V~0.93V
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 0.9V
Terminal Pitch 1mm
JESD-30 Code S-PBGA-B1932
Number of I/O 768
Organization 42720 CLBS
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1150000
Total RAM Bits 68857856
Number of LABs/CLBs 427200
Height Seated (Max) 3.5mm
Length 45mm
Width 45mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
10AX115N4F45I3SGE2 Product Details

10AX115N4F45I3SGE2 Overview


A 1932-BBGA, FCBGA package is provided with this component. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. A total of 768 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block contains 1150000 logic elements or cells. Supply voltage is 0.9V volts. With a Surface Mount connector, this FPGA module can be attached to the development board. In order to operate it, it requires a voltage supply of 0.87V~0.93V . This is a type of FPGA that is part of the Arria 10 GX series of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. A model of this FPGA is contained in Tray for the purpose of saving space. A device like this one offers 68857856 RAM bits, which is a considerable amount of memory. Fpga electronics contains 427200 LABs/CLBs in an array.

10AX115N4F45I3SGE2 Features


768 I/Os
Up to 68857856 RAM bits

10AX115N4F45I3SGE2 Applications


There are a lot of Intel 10AX115N4F45I3SGE2 FPGAs applications.

  • Data center hardware accelerators
  • Medical Electronics
  • Embedded Vision
  • Radar and Sensors
  • Software-defined radios
  • Scientific Instruments
  • Ecosystem
  • Digital signal processing
  • Image processing
  • Automotive advanced driver assistance systems (ADAS)

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