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XE232-1024-FB374-I40

XE232-1024-FB374-I40

XE232-1024-FB374-I40

XMOS

ROMless XCore 32-Bit 32-Core Microcontroller XE Series 374 Pin 374-LFBGA

SOT-23

XE232-1024-FB374-I40 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 374-LFBGA
Number of Pins 374
Supplier Device Package 374-FBGA (18x18)
Operating Temperature-40°C~85°C TA
PackagingTray
Series XE
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature85°C
Min Operating Temperature -40°C
Interface USB
Oscillator TypeExternal
Number of I/O 176
Speed 4000MIPS
RAM Size 1M x 8
Memory TypeROMless
Voltage - Supply (Vcc/Vdd) 0.95V~3.6V
Core Processor XCore
Program Memory TypeROMless
Core Size 32-Bit 32-Core
Connectivity RGMII, USB
Core Architecture XCore
RoHS StatusROHS3 Compliant
In-Stock:268 items

Pricing & Ordering

QuantityUnit PriceExt. Price
84$28.16905$2366.2002

XE232-1024-FB374-I40 Product Details

XE232-1024-FB374-I40 Overview


The package is 374-LFBGA-shaped. There are 176 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 32-Bit 32-Core core architecture. The type of program memory it uses is ROMless. Temperatures in the range of -40°C~85°C TA are operated by this Microcontroller. It is part of the XE series of electrical components. A XCore Core Processor is at the core of this Microcontroller. On the chip, 374 pins are accessible. There is ROMless memory on this piece of equipment. In addition, it comes with a XCore core architecture.

XE232-1024-FB374-I40 Features


374-LFBGA package
Mounting type of Surface Mount
Minimum temperature of -40°C


XE232-1024-FB374-I40 Applications


There are a lot of XMOS
XE232-1024-FB374-I40 Microcontroller applications.


  • Instrument control
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers

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