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XE216-512-FB236-I20

XE216-512-FB236-I20

XE216-512-FB236-I20

XMOS

ROMless XCore 32-Bit 16-Core Microcontroller XE Series 236 Pin 236-LFBGA

SOT-23

XE216-512-FB236-I20 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 236-LFBGA
Number of Pins 236
Supplier Device Package 236-FBGA (10x10)
Operating Temperature-40°C~85°C TA
PackagingTray
Series XE
Published 2015
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature85°C
Min Operating Temperature -40°C
Interface USB
Oscillator TypeExternal
Number of I/O 73
Speed 2000MIPS
RAM Size 512K x 8
Memory TypeROMless
Voltage - Supply (Vcc/Vdd) 0.95V~3.6V
Core Processor XCore
Program Memory TypeROMless
Core Size 32-Bit 16-Core
Connectivity RGMII, USB
Core Architecture XCore
RoHS StatusROHS3 Compliant
In-Stock:415 items

Pricing & Ordering

QuantityUnit PriceExt. Price
168$14.94298$2510.42064

XE216-512-FB236-I20 Product Details

XE216-512-FB236-I20 Overview


There is a 236-LFBGA package available. The board has 73 I/Os. Using the Mounting Type Surface Mount, the MCU is mounted on PCB. A 32-Bit 16-Core core is used in order to power the IC chip. The type of memory it uses for its program is ROMless. -40°C~85°C TA is the temperature range at which this Microcontroller operates. XE-series components are electrical components. Powered by a XCore Core processor. On the chip, there are 236 pins that can be accessed. ROMless memory is one of the features of this equipment. The CPU is based on XCore cores.

XE216-512-FB236-I20 Features


236-LFBGA package
Mounting type of Surface Mount
Minimum temperature of -40°C


XE216-512-FB236-I20 Applications


There are a lot of XMOS
XE216-512-FB236-I20 Microcontroller applications.


  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine

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