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XCZU2EG-3SFVC784E

XCZU2EG-3SFVC784E

XCZU2EG-3SFVC784E

Xilinx Inc.

784 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 252 I/O 0.9V

SOT-23

XCZU2EG-3SFVC784E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 25 Weeks
Package / Case 784-BFBGA, FCBGA
Surface MountYES
Operating Temperature0°C~100°C TJ
PackagingTray
Series Zynq® UltraScale+™ MPSoC EG
Published 2013
Part StatusObsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 784
HTS Code8542.31.00.01
Terminal Position BOTTOM
Terminal FormBALL
Supply Voltage 0.9V
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B784
Number of I/O 252
Speed 600MHz, 667MHz, 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
In-Stock:1689 items

XCZU2EG-3SFVC784E Product Details

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


A Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 784-BFBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq® UltraScale+™ MPSoC EG series.The average operating temps for this SoC meaning should be 0°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Zynq®UltraScale+™ FPGA, 103K+ Logic Cells.Housed in the state-of-art Tray package.252 I/Os in total are included in this SoC part.It is advised to utilize a 0.9V power supply.There are 784 terminations in total and that really benefits system on a chip.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XCZU2EG-3SFVC784E System On Chip (SoC) applications.


  • Automotive gateway
  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors

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