Welcome to Hotenda.com Online Store!

logo
userjoin
Home

XCZU2EG-3SBVA484E

XCZU2EG-3SBVA484E

XCZU2EG-3SBVA484E

Xilinx Inc.

484 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 82 I/O 0.9V

SOT-23

XCZU2EG-3SBVA484E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case 484-BFBGA, FCBGA
Surface MountYES
Operating Temperature0°C~100°C TJ
PackagingTray
Series Zynq® UltraScale+™ MPSoC EG
Published 2013
Part StatusObsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 484
Terminal Position BOTTOM
Terminal FormBALL
Supply Voltage 0.9V
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B484
Number of I/O 82
Speed 600MHz, 667MHz, 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
In-Stock:4223 items

XCZU2EG-3SBVA484E Product Details

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, this SoC has been developed.The manufacturer assigns this system on a chip with a 484-BFBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq® UltraScale+™ MPSoC EG series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 103K+ Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 82 I/Os.For safe operation, it is advisable to utilize a power supply with 0.9V voltage.The system on a chip uses 484 terminations in total.The SoC meaning uses MICROPROCESSOR CIRCUIT as its interface with the peripheral ICs and uPs.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XCZU2EG-3SBVA484E System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical

Get Subscriber

Enter Your Email Address, Get the Latest News