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XCZU19EG-1FFVD1760E

XCZU19EG-1FFVD1760E

XCZU19EG-1FFVD1760E

Xilinx Inc.

0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 308 I/O

SOT-23

XCZU19EG-1FFVD1760E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Package / Case 1760-BBGA, FCBGA
Operating Temperature0°C~100°C TJ
PackagingTray
Series Zynq® UltraScale+™ MPSoC EG
Published 2016
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 308
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
RoHS StatusROHS3 Compliant
In-Stock:32 items

Pricing & Ordering

QuantityUnit PriceExt. Price

XCZU19EG-1FFVD1760E Product Details

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, this SoC has been developed.The manufacturer assigns this system on a chip with a 1760-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq® UltraScale+™ MPSoC EG series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 308 I/Os.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.


There are a lot of Xilinx Inc.


XCZU19EG-1FFVD1760E System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical

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