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XCZU15EG-L2FFVC900E

XCZU15EG-L2FFVC900E

XCZU15EG-L2FFVC900E

Xilinx Inc.

900 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 204 I/O 0.72V

SOT-23

XCZU15EG-L2FFVC900E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Surface MountYES
Operating Temperature0°C~100°C TJ
PackagingTray
Series Zynq® UltraScale+™ MPSoC EG
Published 2016
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
Additional FeatureALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code8542.31.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B900
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 204
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
RoHS StatusROHS3 Compliant
In-Stock:31 items

Pricing & Ordering

QuantityUnit PriceExt. Price

XCZU15EG-L2FFVC900E Product Details

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


A core processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is used to build this SoC.Its package is 900-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq® UltraScale+™ MPSoC EG series.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.A key point to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 747K+ Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 204.A 0.72V power supply should be used.There are voltages higher than 0.742V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 0.698V.Having 900 terminations in total makes system on a chip possible.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.The SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY, which are additional features.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


There are a lot of Xilinx Inc.


XCZU15EG-L2FFVC900E System On Chip (SoC) applications.


  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports

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